MECAHITECH '11,
3rd International Conference on Innovations,
Recent Trends and Challenges in Mechatronics,
Mechanical Engineering and New High-Tech
Products Development
Bucharest, Romania 22 - 23 September 2011

 


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Welcome



New: Starting with this year, MECAHITECH is organized under the aegis of IEEE!


 

The National Institute for Research and Development in Mechatronics and Measuring Technique - INCDMTM - Bucharest, as main organizer, announces the third edition of MECAHITECH International Conference - „3rd International Conference on Innovations, Recent Trends and Challenges in Mechatronics, Mechanical Engineering and New High-Tech Products Development". The Conference will tale place in Bucharest between 22 and 23 of September 2011. 

 

The high scientific papers presented at the conference will be subject to a selection process for the publishing in Romanian Review: Precision Optics, Mechanics and Mechatronics (http://www.incdmtm.ro/editura/revista/), classified last in 2011 by The National Council of Scientific Research in Higher Education (CNCSIS) at the B+ category and indexed in EBSCO and SCOPUS international databases.

 

At the conference, communications on the new accomplishments and implementations will be presented, focusing on the following fields:

 

  • High-tech mechatronic, micro-mechatronic and nano-mechatronic systems;
  • Mechatronic processes in production and intelligent integrated control;
  • Mechatronic Intelligent system production and control;
  • Computer integrated production;
  • Robotics / micro-robotics and nano-robotics;
  • Modelling and simulation;
  • Integrated intelligent control systems;
  • Computer image and imaging processing;
  • Bio-medical and bio-mechatronic systems;
  • Communication and distributed intelligent systems;
  • Technology transfer of High-tech mechatronic products into the industry;
  • High productivity and high added value industrial services;
  • Sensors/micro-nanosensors and transducers/micro-nanotransducer;
  • System and informatic engineering;
  • Integronic engineering;
  • Intelligent micro-engineering;
  • Intelligent measurement technique and of course, other related fields.

 

The organizers of the conference propose you a frame for promoting international cooperation and exchange of best practices in the areas mentioned above and not only.

 

To see the full programme and to find out information related to the registration, please see The First Call for Papers.

 

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